SMTS Packaging Engineer
Advanced Micro Devices
- 서울시
- 정규직
- 풀타임
- Interface closely with AMD’s Foundry and development partners to lead and perform process optimization, yield and reliability improvement.
- Interface closely with AMD’s Assembly and material partners, to develop and productize in bring up of new packaging technology from concept to NPI and prototyping to mass production phases with acceptable sustaining yields.
- Drive/participate in defining FMEA, DFY, DOE, DFM, TV design, material selections, identifying critical process windows and material attributes, defining reliability tests including detection and FA methodology, and executing manufacturing characterization.
- Strong problem solving, communication, organizational, interpersonal, and presentation skills.
- Good knowledge with Advanced Packaging Techniques, including fan-out, 3D stacking, 2.5D and MCM packaging techniques.
- Fundamental understanding and hand-on experience with HBM packaging process development is a plus.
- Good knowledge in design and reliability, such as TV design, CPI, Thermo-mechanical analysis, DFR etc.
- Familiarity with BEOL technologies and TSV integration.
- Good track record of product implementations from new package technology development to qualification, prototype NPI, and HVM.
- Knowledge of product risk assessment, mitigation plans, and establishing best known processes methodology to ensure robust package quality, reliability, and manufacturing yield.
- Master of Science/PhD in materials, mechanical, chemical, or electrical engineering.